Jan Reboun (Jan Řeboun)

Publication Activity (10 Years)

Years Active: 2021-2023
Publications (10 Years): 3

Top Topics

Magnetic Resonance

Oxide Nanoparticles

Room Temperature

Molecularly Imprinted

Top Venues

Materials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

David Kalaš, Radek Soukup, Jan Reboun, Michaela Radouchová, Pavel Rous, Aleš Hamáček
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers 15 (11) (2023)
Jiri Hlina, Jan Reboun, Marek Simonovsky, Tomas Syrovy, Martin Janda, Ales Hamacek
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper. Materials (Basel, Switzerland) 15 (4) (2022)
Jiri Hlina, Jan Reboun, Ales Hamacek
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications. Materials (Basel, Switzerland) 14 (22) (2021)