Ji Hoon Kim

ORCID

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 11

Top Venues

Materials (Basel, Switzerland)

Polymers

Nature materials

Science advances

Pusan National University

This page only lists publications with an associated author ORCID identifier.

Affiliation History

Pusan National University Mar 01 2014

South Korea

Professor :: Mechanical Engineering

Publications

Young Cheol Kim, Hong-Kyu Jang, Geunsu Joo, Ji Hoon Kim
A Comparative Study of Micromechanical Analysis Models for Determining the Effective Properties of Out-of-Autoclave Carbon Fiber-Epoxy Composites. Polymers 16 (8) (2024)
Yoonsoo Shin, Seungki Hong, Yong Chan Hur, Chanhyuk Lim, Kyungsik Do, Ji Hoon Kim, Dae-Hyeong Kim, Sangkyu Lee
Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics. Nature materials (2024)
Young Cheol Kim, Hong-Kyu Jang, Geunsu Joo, Ji Hoon Kim
A Comparative Study of Micromechanical Analysis Models for Determining the Effective Properties of Out-of-Autoclave Carbon Fiber-Epoxy Composites. Polymers 16 (8) (2024)
Yoonsoo Shin, Seungki Hong, Yong Chan Hur, Chanhyuk Lim, Kyungsik Do, Ji Hoon Kim, Dae-Hyeong Kim, Sangkyu Lee
Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics. Nature materials (2024)
Deok Sang Jo, Parviz Kahhal, Ji Hoon Kim
Optimization of Friction Stir Spot Welding Process Using Bonding Criterion and Artificial Neural Network. Materials (Basel, Switzerland) 16 (10) (2023)
Parviz Kahhal, Jaebong Jung, Yong Chan Hur, Young-Hoon Moon, Ji Hoon Kim
Neural Network-Based Multi-Objective Optimization of Adjustable Drawbead Movement for Deep Drawing of Tailor-Welded Blanks. Materials (Basel, Switzerland) 15 (4) (2022)
Chanhyuk Lim, Yongseok Joseph Hong, Jaebong Jung, Yoonsoo Shin, Sung-Hyuk Sunwoo, Seungmin Baik, Ok Kyu Park, Seung Hong Choi, Taeghwan Hyeon, Ji Hoon Kim, Sangkyu Lee, Dae-Hyeong Kim
Tissue-like skin-device interface for wearable bioelectronics by using ultrasoft, mass-permeable, and low-impedance hydrogels. Science advances 7 (19) (2021)
Young Cheol Kim, Soon Ho Yoon, Geunsu Joo, Hong-Kyu Jang, Ji-Hoon Kim, Mungyu Jeong, Ji Hoon Kim
Crash Analysis of Aluminum/CFRP Hybrid Adhesive Joint Parts Using Adhesive Modeling Technique Based on the Fracture Mechanics. Polymers 13 (19) (2021)
Dongjun Jung, Chaehong Lim, Hyung Joon Shim, Yeongjun Kim, Chansul Park, Jaebong Jung, Sang Ihn Han, Sung-Hyuk Sunwoo, Kyoung Won Cho, Dae-Hyeong Kim, Dong Chan Kim, Ja Hoon Koo, Ji Hoon Kim, Taeghwan Hyeon, Dae-Hyeong Kim
Highly conductive and elastic nanomembrane for skin electronics. Science (New York, N.Y.) 373 (6558) (2021)
Jun Ho Lee, Geon Young Lee, Jong-Joo Rha, Ji Hoon Kim, Jae-Hyung Cho
Analysis of Microstructure Evolution and Mechanical Properties during Compression of Open-Cell Ni-Foams with Hollow Struts Using Micro-CT and FEM. Materials (Basel, Switzerland) 15 (1) (2021)
Myoungsuk Kim, Jaebong Jung, Sungmook Jung, Young-Hoon Moon, Dae-Hyeong Kim, Ji Hoon Kim
Piezoresistive Behaviour of Additively Manufactured Multi-Walled Carbon Nanotube/Thermoplastic Polyurethane Nanocomposites. Materials (Basel, Switzerland) 12 (16) (2019)

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Publication Activity (10 Years)

Top Topics

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Ji Hoon Kim