Jun Cao

ORCID

Publication Activity (10 Years)

Years Active: 2020-2024
Publications (10 Years): 19

Top Venues

Micromachines

Materials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Junling Fan, Donglin Yuan, Juan Du, Tao Hou, Furong Wang, Jun Cao, Xuemei Yang, Yuemin Zhang
Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire. Micromachines 15 (7) (2024)
Junling Fan, Donglin Yuan, Juan Du, Tao Hou, Furong Wang, Jun Cao, Xuemei Yang, Yuemin Zhang
Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire. Micromachines 15 (7) (2024)
Junling Fan, Donglin Yuan, Juan Du, Tao Hou, Furong Wang, Jun Cao, Xuemei Yang, Yuemin Zhang
A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface. Materials (Basel, Switzerland) 17 (17) (2024)
Junling Fan, Donglin Yuan, Juan Du, Tao Hou, Furong Wang, Jun Cao, Xuemei Yang, Yuemin Zhang
Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire. Micromachines 15 (7) (2024)
Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, Bin An
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines 14 (2) (2023)
Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang, Chengqiang Cui
Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging. Micromachines 14 (4) (2023)
Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Yingchong Zhang, Bin An, Jie Xia
Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire. Micromachines 14 (8) (2023)
Jun Cao, Xuefeng Wu, Chenghao Su, Hewei Jia, Yongzhen Sun
Processing and Properties of Single-Crystal Copper Wire. Micromachines 14 (11) (2023)
Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui, Yingchong Zhang
Copper Wire Bonding: A Review. Micromachines 14 (8) (2023)
Xuefeng Wu, Hewei Jia, Junling Fan, Jun Cao, Chenghao Su
Study on the Effect of Cold Deformation and Heat Treatment on the Properties of Cu-Ag Alloy Wire. Micromachines 14 (8) (2023)
Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, Bin An
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines 14 (2) (2023)
Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, Bin An
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines 14 (2) (2023)
Jun Cao, Yongzhen Sun, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Chengqiang Cui
Research Status of Manufacturing Technology of Tungsten Alloy Wire. Micromachines 14 (5) (2023)
Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, Bin An
Research Progress on Bonding Wire for Microelectronic Packaging. Micromachines 14 (2) (2023)
Yuemin Zhang, Haiyun Guo, Jun Cao, Xuefeng Wu, Hewei Jia, Andong Chang
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging. Micromachines 14 (8) (2023)
Bin An, Hongliang Zhou, Jun Cao, Pingmei Ming, John Persic, Jingguang Yao, Andong Chang
A Review of Silver Wire Bonding Techniques. Micromachines 14 (11) (2023)
Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Changchun Lv, Kexing Song, Guannan Yang, Chengqiang Cui, Yangguang Gao
Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire. Micromachines 12 (8) (2021)
Jun Cao, Junchao Zhang, Kexing Song, Baoan Wu, Yong Ding, Dingbiao Chen, Yutian Ding
Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength. Micromachines 12 (1) (2020)
Jun Cao, Junchao Zhang, John Persic, Kexing Song
Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire. Micromachines 11 (8) (2020)

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Publication Activity (10 Years)

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Jun Cao