Larysa Kutuzova

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 7

Top Topics

Atomic Force Microscopy

Molecularly Imprinted

Staphylococcus Aureus

Top Venues

This page only lists publications with an associated author ORCID identifier.

Publications

Julian Vogelwaid, Felix Hampel, Martin Bayer, Michael Walz, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, Timo Jacob
In Situ Monitoring of the Curing of Highly Filled Epoxy Molding Compounds: The Influence of Reaction Type and Silica Content on Cure Kinetic Models. Polymers 16 (8) (2024)
Julian Vogelwaid, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, Timo Jacob
Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers 16 (11) (2024)
Julian Vogelwaid, Felix Hampel, Martin Bayer, Michael Walz, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, Timo Jacob
In Situ Monitoring of the Curing of Highly Filled Epoxy Molding Compounds: The Influence of Reaction Type and Silica Content on Cure Kinetic Models. Polymers 16 (8) (2024)
Julian Vogelwaid, Martin Bayer, Michael Walz, Larysa Kutuzova, Andreas Kandelbauer, Timo Jacob
Process Optimization of the Morphological Properties of Epoxy Resin Molding Compounds Using Response Surface Design. Polymers 16 (8) (2024)
Julian Vogelwaid, Martin Bayer, Michael Walz, Larysa Kutuzova, Andreas Kandelbauer, Timo Jacob
Process Optimization of the Morphological Properties of Epoxy Resin Molding Compounds Using Response Surface Design. Polymers 16 (8) (2024)
Julian Vogelwaid, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, Timo Jacob
Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers 16 (11) (2024)
Erick Franieck, Martin Fleischmann, Ole Hölck, Larysa Kutuzova, Andreas Kandelbauer
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis. Polymers 13 (11) (2021)