Meiling Xin

Publication Activity (10 Years)

Years Active: 2022-2022
Publications (10 Years): 2

Top Topics

Aqueous Solution

Transition Metal

Top Venues

Journal of materials science. Materials in electronics

This page only lists publications with an associated author ORCID identifier.

Publications

Meiling Xin, Xiuqi Wang, Fenglian Sun
Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging. Journal of materials science. Materials in electronics 33 (33) (2022)
Meiling Xin, Xiuqi Wang, Fenglian Sun
Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging. Journal of materials science. Materials in electronics 33 (33) (2022)