Tianzhuo Zhan

ResearcherID Scopus Author ID ORCID

Publication Activity (10 Years)

Years Active: 2020-2022
Publications (10 Years): 4

Top Topics

Molecular Dynamics Simulations

Municipal Solid Waste

Staphylococcus Aureus

Top Venues

ACS applied materials & interfaces

Langmuir : the ACS journal of surfaces and colloids

This page only lists publications with an associated author ORCID identifier.

Publications

Qun Dang, Mengjie Song, Chaobin Dang, Tianzhuo Zhan, Long Zhang
Experimental Study on Solidification Characteristics of Sessile Urine Droplets on a Horizontal Cold Plate Surface under Natural Convection. Langmuir : the ACS journal of surfaces and colloids 38 (25) (2022)
Tianzhuo Zhan, Keita Sahara, Haruki Takeuchi, Ryo Yokogawa, Kaito Oda, Zhicheng Jin, Shikang Deng, Motohiro Tomita, Yen-Ju Wu, Yibin Xu, Takeo Matsuki, Haidong Wang, Mengjie Song, Sujun Guan, Atsushi Ogura, Takanobu Watanabe
Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits. ACS applied materials & interfaces 14 (5) (2022)
Tianzhuo Zhan, Shuaizhe Ma, Zhicheng Jin, Hiroki Takezawa, Kohei Mesaki, Motohiro Tomita, Yen-Ju Wu, Yibin Xu, Takashi Matsukawa, Takeo Matsuki, Takanobu Watanabe
Effect of the Thermal Boundary Resistance in Metal/Dielectric Thermally Conductive Layers on Power Generation of Silicon Nanowire Microthermoelectric Generators. ACS applied materials & interfaces 12 (30) (2020)
Tianzhuo Zhan, Kaito Oda, Shuaizhe Ma, Motohiro Tomita, Zhicheng Jin, Hiroki Takezawa, Kohei Mesaki, Yen-Ju Wu, Yibin Xu, Takashi Matsukawa, Takeo Matsuki, Takanobu Watanabe
Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI. ACS applied materials & interfaces 12 (19) (2020)