Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry.
Alena Cedeño LópezV GrimaudoAndreas RiedoM TulejR WiesendangerR LukmanovPavel Moreno-GarcíaE LörtscherPeter WurzPeter BroekmannPublished in: Analytical chemistry (2019)
The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented information on the distribution of individual elements inside the solder bump matrix. Moreover, the determination of matrix-matched relative sensitivity coefficients allows the first report on quantitative assessment of the SnAg alloy composition. These results significantly contribute to an in-depth understanding of the SnAg plating process. This experimental procedure may find application in future additive performance screening.
Keyphrases
- mass spectrometry
- gas chromatography
- high resolution
- liquid chromatography
- solid phase extraction
- tandem mass spectrometry
- optical coherence tomography
- capillary electrophoresis
- high performance liquid chromatography
- single cell
- radiofrequency ablation
- big data
- genome wide
- minimally invasive
- current status
- healthcare
- gene expression
- high speed
- molecularly imprinted
- catheter ablation
- artificial intelligence