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Flexible Epoxy Resins Formed by Blending with the Diblock Copolymer PEO-b-PCL and Using a Hydrogen-Bonding Benzoxazine as the Curing Agent.

Wei-Chen SuFang-Chang TsaiChih-Feng HuangLizong DaiShiao-Wei Kuo
Published in: Polymers (2019)
In this study, we enhanced the toughness of epoxy resin by blending it with the diblock copolymer poly(ethylene oxide⁻b⁻ε-caprolactone) (PEO-b-PCL) with a benzoxazine monomer (PA-OH) as the thermal curing agent. After thermal curing, Fourier transform infrared spectroscopy revealed that intermolecular hydrogen bonding existed between the OH units of the epoxy⁻benzoxazine copolymer and the C⁻O⁻C (C=O) units of the PEO (PCL) segment. Differential scanning calorimetry and dynamic mechanical analysis revealed that the glass transition temperature and storage modulus of the epoxy⁻benzoxazine matrix decreased significantly upon increasing the concentration of PEO-b-PCL. The Kwei equation predicted a positive value of q, consistent with intermolecular hydrogen bonding in this epoxy⁻benzoxazine/PEO-b-PCL blend system. Scanning electron microscopy revealed a wormlike structure with a high aspect ratio for PEO-b-PCL as the dispersed phase in the epoxy⁻benzoxazine matrix; this structure was responsible for the improved toughness.
Keyphrases
  • electron microscopy
  • single cell
  • high resolution
  • drug release
  • mass spectrometry
  • quantum dots
  • data analysis