Towards Three-Dimensional Printed Thermal Conductive Polymeric Composites using a Binary-Composite Hybrid based on Boron Nitride Nanoparticles and Micro-Diamonds.

Thermally conductive polymeric composites are promising for heat management in microelectronic devices. This work presents a binary-hybrid composite of boron nitride (BN) nanoparticles and micro-diamond (D) fillers in an elastomeric polyurethane (PU) matrix which can be three-dimensionally printed to produce a highly flexible and self-supporting structure. The research shows that a combination of 16.7 wt.% BN and 16.7 wt.% D results in a robust network within the polymer matrix to improve the tensile modulus more than 9 times with respect to neat PU. Significantly, the hybrid matrix enhances the thermal conductivity by more than 2 times when compared to neat PU. The enhancement in mechanical, and thermal features make this three-dimensional printable multiscale hybrid composite suitable for flexible and stretchable microelectronic applications. This article is protected by copyright. All rights reserved.