Design and Synthesis of Functional Silane-Based Silicone Resin and Application in Low-Temperature Curing Silver Conductive Inks.

In the field of flexible electronics manufacturing, inkjet printing technology is a research hotspot, and it is key to developing low-temperature curing conductive inks that meet printing requirements and have suitable functions. Herein, methylphenylamino silicon oil (N75) and epoxy-modified silicon oil (SE35) were successfully synthesized through functional silicon monomers, and they were used to prepare silicone resin 1030H with nano SiO 2 . 1030H silicone resin was used as the resin binder for silver conductive ink. The silver conductive ink we prepared with 1030H has good dispersion performance with a particle size of 50-100 nm, as well as good storage stability and excellent adhesion. Additionally, the printing performance and conductivity of the silver conductive ink prepared with n,n-dimethylformamide (DMF): proprylene glycol monomethyl ether (PM) (1:1) as solvent are better than those of the silver conductive ink prepared by DMF and PM solvent. Cured at a low temperature of 160 °C, the resistivity of 1030H-Ag-82%-3 conductive ink is 6.87 × 10 -6 Ω·m, and that of 1030H-Ag-92%-3 conductive ink is 0.564 × 10 -6 Ω·m, so the low-temperature curing silver conductive ink has high conductivity. The low-temperature curing silver conductive ink we prepared meets the printing requirements and has potential for practical applications.