Development of a Simple Electroless Method for Depositing Metallic Pt-Pd Nanoparticles over Wire Gauge Support for Removal of Hydrogen in a Nuclear Reactor.

Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl 2 + PdCl 2 seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H 2 and O 2 recombination reactions for hydrogen mitigation applications in nuclear reactors.