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Wafer-scale detachable monocrystalline germanium nanomembranes for the growth of III-V materials and substrate reuse.

Nicolas PaupyZakaria Oulad ElhmaidiAlexandre ChapototTadeáš HanušJavier Arias-ZapataBouraoui IlahiAlexandre HeintzAlex Brice Poungoué MbeunmiRoxana ArvinteMohammad Reza AziziyanValentin DanielGwenaëlle HamonJérémie ChrétienFiras ZouaghiAhmed AyariLaurie MouchelJonathan HenriquesLoïc DemoulinThierno Mamoudou DialloPhilippe-Olivier ProvostHubert PelletierMaïté VolatierRufi KurstjensJinyoun ChoGuillaume CourtoisKristof DesseinSébastien ArcandChristian DubucAbdelatif JaouadNicolas QuaegebeurRyan GosselinDenis MachonRichard ArèsMaxime DarnonAbderraouf Boucherif
Published in: Nanoscale advances (2023)
Germanium (Ge) is increasingly used as a substrate for high-performance optoelectronics, photovoltaics, and electronic devices. These devices are usually grown on thick and rigid Ge substrates manufactured by classical wafering techniques. Nanomembranes (NMs) provide an alternative to this approach while offering wafer-scale lateral dimensions, weight reduction, waste limitation, and cost effectiveness. Herein, we introduce the Porous germanium Efficient Epitaxial LayEr Release (PEELER) process, which consists of the fabrication of wafer-scale detachable Ge NMs on porous Ge (PGe) and substrate reuse. We demonstrate the growth of Ge NMs with monocrystalline quality as revealed by high-resolution transmission electron microscopy (HRTEM) characterization. Together with the surface roughness below 1 nm, it makes the Ge NMs suitable for growth of III-V materials. Additionally, the embedded nanoengineered weak layer enables the detachment of the Ge NMs. Finally, we demonstrate the wet-etch-reconditioning process of the Ge substrate, allowing its reuse, to produce multiple free-standing NMs from a single parent wafer. The PEELER process significantly reduces the consumption of Ge in the fabrication process, paving the way for a new generation of low-cost flexible optoelectronic devices.
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