Enhanced Activation in Phosphorous-Doped Silicon via Dual-Beam Laser Annealing.

In this study, we conduct a comparative analysis of single-beam laser annealing (SBLA) and dual-beam laser annealing (DBLA) techniques for semiconductor manufacturing. In the DBLA approach, two laser beams were precisely aligned to simultaneously heat a phosphorus-doped silicon (Si) wafer. The main objective was to investigate the impact of the two annealing techniques on the electrical properties, crystalline structure, and diffusion profile of the treated phosphorus-doped Si at equivalent laser powers. Both SBLA and DBLA improved the electrical properties of the phosphorus-doped Si, evidenced by increased carrier concentration and reduced carrier mobility. Additionally, the crystalline structure of the phosphorus-doped Si showed favorable modifications, with no defects and improved crystallinity. While both SBLA and DBLA produced similar phosphorus profiles with no significant redistribution of dopants compared to the as-implanted sample, DBLA achieved a higher activation ratio than SBLA. Although the results suggest improved dopant activation with minimal diffusion, further studies are needed to clearly confirm the effect of DBLA on dopant activation and diffusion.