Giant energy storage and power density negative capacitance superlattices.

Dielectric electrostatic capacitors 1 , due to their ultrafast charge-discharge capability, are attractive for high power energy storage applications. Along with ultrafast operation, on-chip integration can enable miniaturized energy storage devices for emerging autonomous microelectronics and microsystems 2-5 . Additionally, state-of-the-art miniaturized electrochemical energy storage systems - microsupercapacitors and microbatteries - currently face safety, packaging, materials, and microfabrication challenges preventing on-chip technological readiness 2,3,6 , leaving an opportunity for electrostatic microcapacitors. Here we report record-high electrostatic energy storage density (ESD) and power density (PD) in HfO 2 - ZrO 2 -based thin film microcapacitors integrated on silicon, through a three-pronged approach. First, to increase intrinsic energy storage, atomic-layer-deposited antiferroelectric HfO 2 -ZrO 2 films are engineered near a field-driven ferroelectric phase transition to exhibit amplified charge storage via the negative capacitance effect 7-12 , which enhances volumetric-ESD beyond the best-known back-end-of-the-line (BEOL) compatible dielectrics (115 J-cm -3 ) 13 . Second, to increase total energy storage, antiferroelectric superlattice engineering 14 scales the energy storage performance beyond the conventional thickness limitations of HfO 2 -ZrO 2 -based (anti)ferroelectricity 15 (100-nm regime). Third, to increase storage-per-footprint, the superlattices are conformally integrated into three-dimensional capacitors, which boosts areal-ESD (areal-PD) 9-times (170-times) the best-known electrostatic capacitors: 80 mJ-cm -2 (300 kW-cm -2 ). This simultaneous demonstration of ultrahigh energy- and power-density overcomes the traditional capacity-speed trade-off across the electrostatic-electrochemical energy storage hierarchy 1,16 . Furthermore, integration of ultrahigh-density and ultrafast-charging thin films within a BEOL-compatible process enables monolithic integration of on-chip microcapacitors 5 , which can unlock substantial energy storage and power delivery performance for electronic microsystems 17-19 .