Csp3-Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes.
Matthew PaethSam B TyndallLiang-Yu ChenJia-Cheng HongWilliam P CarsonXingwu LiuXiaodong SunJinjia LiuKundi YangElizabeth M HaleDavid L TierneyBin LiuZhi CaoMu-Jeng ChengWilliam A Goddard IiiWei LiuPublished in: Journal of the American Chemical Society (2019)
Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp3-Csp3 bonds. We report herein a general method for the synthesis of a series of [alkyl-CuIII-(CF3)3]- complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp3-CF3 bonds proceeds through a concerted transition state, with a Δ H⧧ = 20 kcal/mol barrier.