Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation.

In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks' functional properties.