Multiscale architectures boosting thermoelectric performance of copper sulfide compound.
Xin-Qi ChenSheng-Jie FanChao HanTian WuLian-Jun WangWan JiangWei DaiJian-Ping YangPublished in: Rare metals (2021)
The online version of this article (10.1007/s12598-020-01698-6) contains supplementary material, which is available to authorized users.