Bond Relationship of Carbon Fiber-Reinforced Polymer (CFRP) Strengthened Steel Plates Exposed to Service Temperature.
Hui Li LyeBashar S MohammedMohamed Mubarak Abdul WahabMohd Shahir LiewPublished in: Materials (Basel, Switzerland) (2021)
Emerging as a new technology, carbon fiber-reinforced polymer (CFRP) has been introduced to rehabilitate and strengthen steel structures using an adhesive agent. However, the outdoor service temperature is potentially degrading to the mechanical strength of the adhesive, as well as affecting the bonding of the strengthened steel structure. Therefore, this paper aims to investigate the bond relationship of CFRP-strengthened steel plates exposed to service temperatures. Two types of experiments were conducted to determine the tensile and flexural performance of CFRP-strengthened steel plates. The experiments were designed using a Box-Behnken design (BBD) and response surface methodology (RSM) by considering three parameters: service temperature (25 °C, 45 °C and 70 °C), number of CFRP layers (one, three and five layers) and bond length (40, 80 and 120 mm). The findings show the dominant failure mode transformed from adhesion failure between steel and adhesive interfaces to adhesion failure between CFRP and adhesive interfaces as the service temperature increased. The tensile strength improved by 25.62% when the service temperature increased. Field emission scanning electron microscope (FESEM) analysis proved that the strength enhancement is due to the densification and reduction of the adhesive particle microstructure gaps through the softening effect at service temperature. However, service temperature is found to have less impact on flexural strength. Incorporating the experimental results in RSM, two quadratic equations were developed to estimate the tensile and flexural strength of CFRP-strengthened steel plates. The high coefficient of determination, R2, yields at 0.9936 and 0.9846 indicate the high reliability of the models. Hence, it can be used as an estimation tool in the design stage.