Enhanced Organic Thin-Film Transistor Stability by Preventing MoO 3 Diffusion with Metal/MoO 3 /Organic Multilayered Interface Source-Drain Contact.

The source-drain electrode with a MoO 3 interfacial modification layer (IML) is considered the most promising method to solve electrical contact issues impeding organic thin-film transistors (OTFTs) from commercialization. However, this method raises many concerns because MoO 3 might diffuse into organic materials, which causes device instability. In this work, we observed a significant device stability degradation by damaging on/off switching performance caused by MoO 3 diffusion. To prevent the MoO 3 diffusion, a source-drain electrode with a multilayered interface contact (MIC) consisting of a top-down stack of metal, MoO 3 IML, and organic buffer layer (OBL) is proposed. In the MIC device, the MoO 3 IML serves well for its intended functions of reducing contact resistance and suppressing minority carrier injection to the OTFT channel. The inclusion of OBL to the MIC helps block MoO 3 diffusion and thereby leads to better device stability and an increased on/off ratio. Through combinations with several organic compounds as a buffer layer, the MoO 3 diffusion related electrical behaviors of OTFTs are systematically studied. Key parameters related to MoO 3 diffusion such as the Fick coefficient and bias-stress stability such as carrier trapping time are extracted from numerical device analysis. Finally, we summarize a general rule of material selection for making robust source-drain contact.