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Cyclical Annealing Technique To Enhance Reliability of Amorphous Metal Oxide Thin Film Transistors.

Hong-Chih ChenTing-Chang ChangWei-Chih LaiGuan-Fu ChenBo-Wei ChenYu-Ju HungKuo-Jui ChangKai-Chung ChengChen-Shuo HuangKuo-Kuang ChenHsueh-Hsing LuYu-Hsin Lin
Published in: ACS applied materials & interfaces (2018)
This study introduces a cyclical annealing technique that enhances the reliability of amorphous indium-gallium-zinc-oxide (a-IGZO) via-type structure thin film transistors (TFTs). By utilizing this treatment, negative gate-bias illumination stress (NBIS)-induced instabilities can be effectively alleviated. The cyclical annealing provides several cooling steps, which are exothermic processes that can form stronger ionic bonds. An additional advantage is that the total annealing time is much shorter than when using conventional long-term annealing. With the use of cyclical annealing, the reliability of the a-IGZO can be effectively optimized, and the shorter process time can increase fabrication efficiency.
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