Choline chloride enhances the electrochemical stability of zinc plating/stripping.

Herein, choline chloride (CC) is adopted as an additive in an aqueous ZnCl 2 electrolyte to enhance the electrochemical stability of zinc plating/stripping. The choline cation can be adsorbed on the zinc anode surface to inhibit the zinc dendrite growth. Meanwhile, the -OH group can disrupt the initial hydrogen bond networks in the electrolyte, which can alleviate the water-induced side reactions. As a result, the Zn||Zn symmetric cell stably cycles for over 1700 h (1.0 mA cm -2 , 0.5 mA h cm -2 ).