Hyoungsub Kim

Publication Activity (10 Years)

Years Active: 2018-2023
Publications (10 Years): 6

Top Topics

Raman Spectroscopy

Transition Metal

Molecular Dynamics Simulations

Top Venues

ACS applied materials & interfaces

This page only lists publications with an associated author ORCID identifier.

Publications

Heesoo Lee, Hoijoon Kim, Kihyun Kim, Kwang-Sik Jeong, Mirine Leem, Seunghyun Park, Jieun Kang, Geun Young Yeom, Hyoungsub Kim
Three-Dimensional Surface Treatment of MoS 2 Using BCl 3 Plasma-Derived Radicals. ACS applied materials & interfaces (2023)
Eun Hye Kim, Do Hee Lee, Tae Jun Gu, Hyobin Yoo, Yamujin Jang, Jaemo Jeong, Hyun-Woo Kim, Seog-Gyun Kang, Hoijoon Kim, Heesoo Lee, Kyu-Jin Jo, Beom Ju Kim, Jin Wook Kim, Seong Hyun Im, Chang Seok Oh, Changgu Lee, Ki Kang Kim, Cheol-Woong Yang, Hyoungsub Kim, Youngkuk Kim, Philip Kim, Hyeon-Sik Jang, Joung Real Ahn
Wafer-Scale Epitaxial Growth of an Atomically Thin Single-Crystal Insulator as a Substrate of Two-Dimensional Material Field-Effect Transistors. Nano letters (2023)
Hyangsook Lee, Duk-Hyun Choe, Sanghyun Jo, Jung-Hwa Kim, Hyun Hwi Lee, Hyun-Joon Shin, Yeehyun Park, Seunghun Kang, Yeonchoo Cho, Seontae Park, Taehwan Moon, Deokjoon Eom, Mirine Leem, Yunseok Kim, Jinseong Heo, Eunha Lee, Hyoungsub Kim
Unveiling the Origin of Robust Ferroelectricity in Sub-2 nm Hafnium Zirconium Oxide Films. ACS applied materials & interfaces 13 (30) (2021)
Dae-Kyoung Kim, Seok-Bo Hong, Kwangsik Jeong, Changmin Lee, Hyoungsub Kim, Mann-Ho Cho
P-N Junction Diode Using Plasma Boron-Doped Black Phosphorus for High-Performance Photovoltaic Devices. ACS nano 13 (2) (2019)
Byeong-Seon An, Yena Kwon, Jin-Su Oh, Changmin Lee, Seongheum Choi, Hyoungsub Kim, Miji Lee, Sangwoo Pae, Cheol-Woong Yang
Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect. ACS applied materials & interfaces 12 (2) (2019)
Seung-Hwan Kim, Gwang-Sik Kim, June Park, Changmin Lee, Hyoungsub Kim, Jiyoung Kim, Joon Hyung Shim, Hyun-Yong Yu
Novel Conductive Filament Metal-Interlayer-Semiconductor Contact Structure for Ultralow Contact Resistance Achievement. ACS applied materials & interfaces 10 (31) (2018)