Jeonyoon Lee

Publication Activity (10 Years)

Years Active: 2023-2024
Publications (10 Years): 7

Top Topics

Tissue Engineering

Carbon Nanotubes

Top Venues

ACS applied materials & interfaces

This page only lists publications with an associated author ORCID identifier.

Publications

Carina Xiaochen Li, Travis J Hank, Estelle Kalfon-Cohen, Carolina Furtado, Jeonyoon Lee, Shannon Cassady, Joshua Tucker, Seth S Kessler, Brian L Wardle
Manufacturing Autoclave-Grade Thermoset Carbon Fiber-Reinforced Polymer Aerospace Composites without an Autoclave Using Nanoporous Materials. ACS applied materials & interfaces (2024)
Carina Xiaochen Li, Travis J Hank, Estelle Kalfon-Cohen, Carolina Furtado, Jeonyoon Lee, Shannon Cassady, Joshua Tucker, Seth S Kessler, Brian L Wardle
Manufacturing Autoclave-Grade Thermoset Carbon Fiber-Reinforced Polymer Aerospace Composites without an Autoclave Using Nanoporous Materials. ACS applied materials & interfaces 16 (19) (2024)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements. ACS applied materials & interfaces (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)