Seong Su Kim

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 14

Top Topics

Sensitive Detection

Loop Mediated Isothermal Amplification

Top Venues

ACS applied materials & interfaces

Science advances

This page only lists publications with an associated author ORCID identifier.

Publications

Hyunsoo Hong, Wonki Kim, Wonvin Kim, Jae-Moon Jeong, Samuel Kim, Seong Su Kim
Machine Learning-Driven Design Optimization of Buckling-Induced Quasi-Zero Stiffness Metastructures for Low-Frequency Vibration Isolation. ACS applied materials & interfaces (2024)
Hyunsoo Hong, Wonki Kim, Wonvin Kim, Jae-Moon Jeong, Samuel Kim, Seong Su Kim
Machine Learning-Driven Design Optimization of Buckling-Induced Quasi-Zero Stiffness Metastructures for Low-Frequency Vibration Isolation. ACS applied materials & interfaces 16 (14) (2024)
Hyunsoo Hong, Wonki Kim, Wonvin Kim, Jae-Moon Jeong, Samuel Kim, Seong Su Kim
Machine Learning-Driven Design Optimization of Buckling-Induced Quasi-Zero Stiffness Metastructures for Low-Frequency Vibration Isolation. ACS applied materials & interfaces 16 (14) (2024)
Hyunsoo Hong, Wonki Kim, Wonvin Kim, Jae-Moon Jeong, Samuel Kim, Seong Su Kim
Machine Learning-Driven Design Optimization of Buckling-Induced Quasi-Zero Stiffness Metastructures for Low-Frequency Vibration Isolation. ACS applied materials & interfaces 16 (14) (2024)
Mohamad A Raja, Su Hyun Lim, Doyun Jeon, Sangyoon Bae, Woong Oh, Inyeong Yang, Dajeong Kang, Jawon Ha, Ha Eun Lee, Il-Kwon Oh, Sanha Kim, Seong Su Kim
Thin, Uniform, and Highly Packed Multifunctional Structural Carbon Fiber Composite Battery Lamina Informed by Solid Polymer Electrolyte Cure Kinetics. ACS applied materials & interfaces (2024)
Hyunsoo Hong, Wonki Kim, Wonvin Kim, Jae-Moon Jeong, Samuel Kim, Seong Su Kim
Machine Learning-Driven Design Optimization of Buckling-Induced Quasi-Zero Stiffness Metastructures for Low-Frequency Vibration Isolation. ACS applied materials & interfaces 16 (14) (2024)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces (2023)
Dajeong Kang, Jae-Moon Jeong, Kwang Il Jeong, Seong Su Kim
Improving the Deformability and Recovery Moment of Shape Memory Polymer Composites for Bending Actuators: Multiple Neutral Axis Skins and Deployable Core. ACS applied materials & interfaces (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)
Dajeong Kang, Jae-Moon Jeong, Kwang Jeong, Seong Su Kim
Correction to "Improving Deformability and Recovery Moment of Shape Memory Polymer Composites for Bending Actuators: Multiple Neutral Axis Skins and Deployable Core". ACS applied materials & interfaces (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements. ACS applied materials & interfaces (2023)
Seong Yeon Park, Seung Yoon On, Junmo Kim, Jeonyoon Lee, Taek-Soo Kim, Brian L Wardle, Seong Su Kim
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles. ACS applied materials & interfaces 15 (8) (2023)
Jungrak Choi, Chankyu Han, Seokjoo Cho, Kyuyoung Kim, Junseong Ahn, Dionisio Del Orbe, Incheol Cho, Zhi-Jun Zhao, Yong Suk Oh, Hyunsoo Hong, Seong Su Kim, Inkyu Park
Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoforming. Science advances 7 (42) (2021)