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Tae-Hyung Lee
(Jong-Ho Back)
ORCID
Publication Activity (10 Years)
Years Active: 2021-2024
Publications (10 Years): 8
Top Topics
Social Support
Hyaluronic Acid
Radical Prostatectomy
Cystic Fibrosis
Top Venues
Advanced healthcare materials
ACS applied materials & interfaces
RSC advances
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This page only lists publications with an associated author ORCID identifier.
Publications
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Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch.
Advanced healthcare materials
(2024)
Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch.
Advanced healthcare materials
(2024)
Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch.
Advanced healthcare materials
13 (12) (2024)
Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch.
Advanced healthcare materials
(2024)
Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Noncovalently Associated Hydrogel Adhesives for Wound Sealing Patch.
Advanced healthcare materials
13 (12) (2024)
Gi-Yeon Han
,
Ji Yong Park
,
Tae-Hyung Lee
,
Mo-Beom Yi
,
Hyun-Joong Kim
Highly Resilient Dual-Crosslinked Hydrogel Adhesives Based on a Dopamine-Modified Crosslinker.
ACS applied materials & interfaces
14 (32) (2022)
Tae-Hyung Lee
,
Gi-Yeon Han
,
Mo-Beom Yi
,
Jae-Ho Shin
,
Hyun-Joong Kim
Photoresponsive, switchable, pressure-sensitive adhesives: influence of UV intensity and hydrocarbon chain length of low molecular weight azobenzene compounds.
RSC advances
11 (59) (2021)
Tae-Hyung Lee
,
Gi-Yeon Han
,
Mo-Beom Yi
,
Hyun-Joong Kim
,
Jae-Hak Lee
,
Seungman Kim
Rapid Photoresponsive Switchable Pressure-Sensitive Adhesive Containing Azobenzene for the Mini-Light Emitting Diode Transfer Process.
ACS applied materials & interfaces
13 (36) (2021)