Tsan-Feng Lu

Publication Activity (10 Years)

Years Active: 2024-2024
Publications (10 Years): 15

Top Topics

Aqueous Solution

Molecular Dynamics Simulations

Reduced Graphene Oxide

Top Venues

Materials (Basel, Switzerland)

Nanomaterials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, Yew Chung Sermon Wu
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (13) (2024)
Tsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu, Chia-Yu Hsu, YewChung Sermon Wu
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism. Materials (Basel, Switzerland) 17 (9) (2024)
Tsan-Feng Lu, Ping-Yang Lee, Yew Chung Sermon Wu
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging. Materials (Basel, Switzerland) 17 (10) (2024)
Tsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu, Chia-Yu Hsu, YewChung Sermon Wu
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism. Materials (Basel, Switzerland) 17 (9) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)
Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, Yew Chung Sermon Wu
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (13) (2024)
Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Ping-Yang Lee, Yew Chung Sermon Wu
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging. Materials (Basel, Switzerland) 17 (10) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)