Yuan-Fu Cheng

Publication Activity (10 Years)

Years Active: 2024-2024
Publications (10 Years): 11

Top Topics

Aqueous Solution

Cystic Fibrosis

Staphylococcus Aureus

Top Venues

Nanomaterials (Basel, Switzerland)

Materials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, Yew Chung Sermon Wu
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (13) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)
Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang, Yew Chung Sermon Wu
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu-Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (13) (2024)
Tsan-Feng Lu, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, Yew Chung Sermon Wu
Eliminating Cu-Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials (Basel, Switzerland) 17 (14) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, Yew Chung Sermon Wu
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces. Nanomaterials (Basel, Switzerland) 14 (10) (2024)
Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen, Yew Chung Sermon Wu
Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification. Nanomaterials (Basel, Switzerland) 14 (9) (2024)