Chih Chen

Publication Activity (10 Years)

Years Active: 2018-2024
Publications (10 Years): 26

Top Topics

Carbon Nanotubes

Atomic Force Microscopy

Top Venues

Materials (Basel, Switzerland)

Nanomaterials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Dinh-Phuc Tran, Yu-Ting Liu, Chih Chen
Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints. Materials (Basel, Switzerland) 17 (9) (2024)
Dinh-Phuc Tran, Yu-Ting Liu, Chih Chen
Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints. Materials (Basel, Switzerland) 17 (9) (2024)
Pin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, Chih Chen
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials (Basel, Switzerland) 13 (9) (2023)
Shou-Yi Chang, Yi-Chung Huang, Shao-Yi Lin, Chia-Ling Lu, Chih Chen, Ming Dao
In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates. Nanomaterials (Basel, Switzerland) 13 (1) (2023)
Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen
Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures. Materials (Basel, Switzerland) 16 (17) (2023)
Pin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, Chih Chen
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials (Basel, Switzerland) 13 (9) (2023)
Shou-Yi Chang, Yi-Chung Huang, Shao-Yi Lin, Chia-Ling Lu, Chih Chen, Ming Dao
In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates. Nanomaterials (Basel, Switzerland) 13 (1) (2023)
Shou-Yi Chang, Yi-Chung Huang, Shao-Yi Lin, Chia-Ling Lu, Chih Chen, Ming Dao
In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates. Nanomaterials (Basel, Switzerland) 13 (1) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Wei-You Hsu, Shih-Chi Yang, You-Yi Lin, Wan-Zhen Hsieh, King-Ning Tu, Wei-Lan Chiu, Hsiang-Hung Chang, Ching-Yu Chiang, Chih Chen
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO 2 Hybrid Joints. Nanomaterials (Basel, Switzerland) 13 (17) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
Low-Temperature Cu/SiO 2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials (Basel, Switzerland) 15 (5) (2022)
Po-Fan Lin, Dinh-Phuc Tran, Hung-Che Liu, Yi-Yi Li, Chih Chen
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials (Basel, Switzerland) 15 (3) (2022)
Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials (Basel, Switzerland) 15 (20) (2022)
Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen
Failures of Cu-Cu Joints under Temperature Cycling Tests. Materials (Basel, Switzerland) 15 (14) (2022)
Yu-An Shen, Li Chang, Shou-Yi Chang, Yi-Chia Chou, K N Tu, Chih Chen
Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain. Nanotechnology 33 (15) (2022)
Yu-Wen Hung, Dinh-Phuc Tran, Chih Chen
Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating. Nanomaterials (Basel, Switzerland) 11 (8) (2021)
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K N Tu, Chih Chen
Effect of Bonding Strength on Electromigration Failure in Cu-Cu Bumps. Materials (Basel, Switzerland) 14 (21) (2021)
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen
Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling. Materials (Basel, Switzerland) 14 (19) (2021)
Yu-Jin Li, King-Ning Tu, Chih Chen
Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned Copper. Materials (Basel, Switzerland) 13 (5) (2020)
Yu-Jin Li, King-Ning Tu, Chih Chen
Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures. Materials (Basel, Switzerland) 13 (6) (2020)
Tien-Lin Lu, Yu-An Shen, John A Wu, Chih Chen
Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition. Materials (Basel, Switzerland) 13 (1) (2019)
John A Wu, Chih-Yang Huang, Wen-Wei Wu, Chih Chen
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding. Materials (Basel, Switzerland) 11 (11) (2018)
Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, K N Tu, Chih Chen
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu. Materials (Basel, Switzerland) 11 (12) (2018)