Kai-Cheng Shie

Publication Activity (10 Years)

Years Active: 2021-2023
Publications (10 Years): 7

Top Topics

Carbon Nanotubes

Metal Organic Framework

Top Venues

Nanomaterials (Basel, Switzerland)

Materials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials (Basel, Switzerland) 15 (20) (2022)
Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen
Failures of Cu-Cu Joints under Temperature Cycling Tests. Materials (Basel, Switzerland) 15 (14) (2022)
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen
Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling. Materials (Basel, Switzerland) 14 (19) (2021)