Dinh-Phuc Tran

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 12

Top Topics

Carbon Nanotubes

Atomic Force Microscopy

Metal Organic Framework

Top Venues

Materials (Basel, Switzerland)

Nanomaterials (Basel, Switzerland)

This page only lists publications with an associated author ORCID identifier.

Publications

Dinh-Phuc Tran, Yu-Ting Liu, Chih Chen
Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints. Materials (Basel, Switzerland) 17 (9) (2024)
Dinh-Phuc Tran, Yu-Ting Liu, Chih Chen
Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints. Materials (Basel, Switzerland) 17 (9) (2024)
Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen
Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures. Materials (Basel, Switzerland) 16 (17) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials (Basel, Switzerland) 13 (4) (2023)
Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen
Low-Temperature Cu/SiO 2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials (Basel, Switzerland) 15 (5) (2022)
Po-Fan Lin, Dinh-Phuc Tran, Hung-Che Liu, Yi-Yi Li, Chih Chen
Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials (Basel, Switzerland) 15 (3) (2022)
Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials (Basel, Switzerland) 15 (20) (2022)
Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen
Failures of Cu-Cu Joints under Temperature Cycling Tests. Materials (Basel, Switzerland) 15 (14) (2022)
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen
Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling. Materials (Basel, Switzerland) 14 (19) (2021)