IEEE transactions on components, packaging, and manufacturing technology

Keyphrases

Publications

volume 14, number 6, 2024

Junghyun Park, Jiayou Xu, Anthony Engler, Jaimal Williamson, Varughese Mathew, Sunggook Park, John Flake
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies. IEEE transactions on components, packaging, and manufacturing technology 14 (6) (2024)

volume 10, number 2, 2020

Muneeb Zia, Bryce Chung, Samuel Sober, Muhannad S Bakir
Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording. IEEE transactions on components, packaging, and manufacturing technology 10 (2) (2020)

volume 9, number 5, 2019

Tao Zhang, Melissa Tsang, Lin Du, Minsoo Kim, Mark G Allen
Electrical Interconnects Fabricated From Biodegradable Conductive Polymer Composites. IEEE transactions on components, packaging, and manufacturing technology 9 (5) (2019)

volume 5, number 9, 2015

Shuodao Wang, Yonggang Huang, John A Rogers
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics. IEEE transactions on components, packaging, and manufacturing technology 5 (9) (2015)