Harm C M Knoops (H C M Knoops)

Scopus Author ID ORCID

Publication Activity (10 Years)

Years Active: 2017-2022
Publications (10 Years): 6

Top Topics

Electron Microscopy

Room Temperature

Escherichia Coli

Acute Heart Failure

Top Venues

ACS applied nano materials

The journal of physical chemistry. C, Nanomaterials and interfaces

Chemistry of materials : a publication of the American Chemical Society

The Journal of chemical physics

This page only lists publications with an associated author ORCID identifier.

Publications

Sven H Gerritsen, Nicholas J Chittock, Vincent Vandalon, Marcel A Verheijen, Harm C M Knoops, Wilhelmus Erwin M M Kessels, Adriaan J M Mackus
Surface Smoothing by Atomic Layer Deposition and Etching for the Fabrication of Nanodevices. ACS applied nano materials 5 (12) (2022)
Sven H Gerritsen, Nicholas J Chittock, Vincent Vandalon, Marcel A Verheijen, Harm C M Knoops, Wilhelmus Erwin M M Kessels, Adriaan J M Mackus
Surface Smoothing by Atomic Layer Deposition and Etching for the Fabrication of Nanodevices. ACS applied nano materials 5 (12) (2022)
Karsten Arts, Harvey Thepass, Marcel A Verheijen, Riikka L Puurunen, Wilhelmus Erwin M M Kessels, Harm C M Knoops
Impact of Ions on Film Conformality and Crystallinity during Plasma-Assisted Atomic Layer Deposition of TiO2. Chemistry of materials : a publication of the American Chemical Society 33 (13) (2021)
Karsten Arts, Sanne Deijkers, Riikka L Puurunen, Wilhelmus Erwin M M Kessels, Harm C M Knoops
Oxygen Recombination Probability Data for Plasma-Assisted Atomic Layer Deposition of SiO2 and TiO2. The journal of physical chemistry. C, Nanomaterials and interfaces 125 (15) (2021)
I J M Erkens, M A Verheijen, Harm C M Knoops, W Keuning, Fred Roozeboom, W M M Kessels
Plasma-assisted atomic layer deposition of conformal Pt films in high aspect ratio trenches. The Journal of chemical physics 146 (5) (2018)
Tahsin Faraz, Maarten van Drunen, Harm C M Knoops, Anupama Mallikarjunan, Iain Buchanan, Dennis M Hausmann, Jon Henri, Wilhelmus M M Kessels
Atomic Layer Deposition of Wet-Etch Resistant Silicon Nitride Using Di(sec-butylamino)silane and N2 Plasma on Planar and 3D Substrate Topographies. ACS applied materials & interfaces 9 (2) (2017)