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Use of a Thermodynamic Sensor in Monitoring Fermentation Processes in Gluten-Free Dough Proofing.

Martin AdamekMagdalena ZvonkovaIva BurešováMartin BuranVeronika SevcikovaRomana SebestikovaAnna AdámkováNela SkowronkovaJiri Mlcek
Published in: Sensors (Basel, Switzerland) (2023)
Dough fermentation in gluten-free bakery products is problematic due to the absence of gluten, which provides advantageous rheological properties. A thermodynamic sensor (TDS) system combined with an electronic nose was tested as an alternative to conventional methods monitoring dough development based on mechanical properties. In the first part, the configuration of the sensors in the thermodynamic system and their response to different heat-source positions, which significantly affect the output signal from the measurement system, were investigated. The practical contribution lies in the application of the measurements to the example of gluten-free doughs with and without edible insect enrichment. An optimized configuration of the thermodynamic system (one sensor on the inner wall of the container at the bottom and another in the middle of the container closer to the top of the dough) in combination with an experimental electronic nose was used for the aforementioned measurement. In some cases, up to 87% correlation between the signal from the TDS and the signals from a professional rheofermentometer Rheo F-4 (Chopin) was demonstrated. The differences between the results can be explained by the use of different techniques. Using a combination of sensor systems in one place, one time and one sample can lead to more comprehensive and robust results. Furthermore, it was shown that the fermentation activity increased in corn dough with the addition of insects compared to dough without the addition. In rice flour dough with the addition of edible insects, fermentation activity was similar to that of the flour without the addition.
Keyphrases
  • celiac disease
  • saccharomyces cerevisiae
  • lactic acid
  • irritable bowel syndrome
  • aqueous solution
  • heat stress
  • low cost